Welcome to the Scalable Energy-efficient Architecture Lab

The Scalable Energy-efficient Architecture Lab (SEAL) is a research group advised by Prof. Yuan Xie at The University of California, Santa Barbara in the Department of Electrical and Computer Engineering. SEAL research focuses on, but not limited to, VLSI design, electronic design automation, computer architecture, and embedded systems design. Specifically, recent research projects focus on technology-driven and application-driven design/architecture innovations. The technology-driven research projects include EDA/architecture for emerging memory technologies and 3D integrated circuits, hardware security, and heterogeneous computing with CPU/GPU/FPGA. The application-driven research projects include novel architectures for machine learning acceleration, neuromorphic computing, hardware acceleration for emerging applications such as bioinformatics applications, graphics analytics, and VR/AR applications

Our research sponsors include the National Science Foundation (NSF), Defense Advanced Research Projects Agency (DARPA), Department of Energy (DoE), Office of Naval Research (ONR), Semiconductor Research Corporation (SRC), IBM, The Technology Collaborative, Honda, Toyota, Qualcomm, and the Industrial Technology Research Institute (ITRI).


Recent News

(06/2016)[Honor] Prof. Xie was inducted into ISCA Hall of Fame, this is another honor since he was inducted into HPCA Hall of Fame last year.
(01/2016)[Award] Cong Xu's dissertation has been selected as the honorable mention of SPEC Distinguished Dissertation Award 2015, for contributions to modeling, circuit design and microarchitecture for emerging resistive memory.
(01/2016)[Service] Prof. Xie was appointed as the Associate Editor of IEEE Embedded Systems Letters from 2016 to 2018.
(11/2015)[Service] Professor Xie has been appointed as the next Editor-in-Chief of ACM Journal on Emerging Technologies in Computing (JETC) by ACM Publications Board.
(09/2015)[Award]  Mr. Peng Gu receives 2015-2016 Holbrook Foundation Fellowship by Institute for Energy Efficiency of UCSB
(02/2015)[Award] Kaisheng Ma, Yang Zheng, and Shuangchen Li, together with PSU and Tsinghua collaborators, won [HPCA 2015 Best Paper Award].
(12/2014)[Award] Jishen Zhao's paper received the [Best Paper Honorable Mention Award] at MICRO-46.
(12/2014)[IEEE Fellow] Yuan Xie is elevated to IEEE Fellow due to contributions in design automation and architecture for 3D ICs.
(10/2014)[Award] Congratulations to Ping Chi for ACM SRC award at ICCAD 2014.
(10/2014)[Award] Congratulations to Ping Chi for [ICCAD 2014 Best Paper Award] (IEEE/ACM William J. McCalla ICCAD Best Paper Award).

Research Highlights

A three dimensional (3D) chip is a stack of multiple device layers with direct vertical interconnects tunneling through them. A key benefit of this approach over a traditional two dimensional chip is the ability to reduce the length of long interconnects.
In recent years, emerging non-volatile memory (NVM) technologies, e.g., Phase-Change RAM (PCRAM), STT-RAM (MRAM) Resistive RAM (RRAM), and Memristors, have gained substantial attentions and a
The challenges in fabricating transistors with diminutive feature sizes in the nanometer regimes have resulted in significant variations in key transistor parameters, such as transistor channel length, gate-oxide thickness, and threshold voltage. This manufacturing variability can  cause... more
Process scaling and aggressive performance improvements have resulted in power consumption becoming a first-order design criterion. For example, the latest Intel Pentium 4 processor (Prescott, 2004) has a power consumption of 103 Watts, almost four times larger than that of the Pentium III (1999).... more
Embedded systems are of great economic importance. Embedded applications include consumer electronics appliance, signal processing, automobile control, aircraft autopilot, and so on. It is estimated that the embedded system market sales was approximately $46 billion in 2004 and expected to grow at... more